PCB boards Picture | 10 layer PCB board

Burn In Boards

HIGH DENSITY INTERCONNECT BOARDS

13 Varying Levels of Depth with Back Drill
I 6.35 mm Thickness I 30 layers
Hole Pitch 0.8 mm
N4000-13SI (NELCO) + FR4 High Tg
Minimum Drill Dia 0.3 mm I Aspect Ratio 21:2
Immersion Gold Finish I Dimensions 59.5 x 109.5 mm

0.4 mm Pitch Burn in Board

1.57 mm Thickness I 10 layers I Polyimide
Minimum Drill Dia 0.15 mm
Hole Pitch 0.4 mm
Electrolytic Gold Finish
Dimensions 605.9 x 313.1 mm

HIGH DENSITY INTERCONNECT BOARDS

Interstitial Via Hole (IVH) Board, 1 to 38 Layers & 39 to 54 Layers , HPL
5.25 mm Thickness I 54 layers I Hole Pitch 0.8 mm
N4000-13SI (NELCO) + FR4 High Tg
Minimum Drill Dia 0.3 mm I Aspect Ratio 17:5
Immersion Gold Finish I Hole Pitch 0.8 mm
Dimensions 99 x 126 mm

Burn In Boards

4 to 22 Layers
FR-4, polyimide, FR-4 High Tg, BT-Resin
0.3 to 2.4 Thickness
Min Hole Dia. 0.15 mm
Gold Fingers & Electroless Gold Plating
Hole Pitch 0.4 mm